Ottawa’s Tundra Semiconductor Corp is launching a $28-million R&D project to develop switch-fabric-based system interconnect products based on the serial interconnect standard, RapidIO. Tundra is receiving $7 million in assistance from Technology Partnerships Canada to develop RapidIO-based systems, a layered architecture allowing for scalability and future enhancements while maintaining backwards compatibility. RapidIO has higher bus speeds facilitating chip-to-chip and board-to-board communications at levels ranging from one gigabit to 60 gigabits per second. RapidIO is designed primarily for networking and communications equipment, enterprise storage, and other high-performance embedded markets for sectors such as aerospace, defence, environmental technologies, biotechnology and information and communications technologies….